ZHCSEE7 November 2015 TMP175-Q1 , TMP75-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機(jī)械、封裝和可訂購信息
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
5 Pin Configuration and Functions
DGK, D Packages
8-Pin VSSOP, SOIC
Top View
NOTE: Pin 1 is determined by orienting the package marking as indicated in the diagram.
Pin Functions
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NO. | NAME | ||
| 1 | SDA | I/O | Serial data. Open-drain output; requires a pullup resistor. |
| 2 | SCL | I | Serial clock. Open-drain output; requires a pullup resistor. |
| 3 | ALERT | O | Overtemperature alert. Open-drain output; requires a pullup resistor. |
| 4 | GND | — | Ground |
| 5 | A2 | I | Address select. Connect to GND, V+, or (for the TMP175-Q1 device only) leave these pins floating. |
| 6 | A1 | ||
| 7 | A0 | ||
| 8 | V+ | I | Supply voltage, 2.7 V to 5.5 V |