SBOS371B August   2006  – October 2014 TMP401

PRODUCTION DATA.  

1. 1 Features
2. 2 Applications
3. 3 Description
4. 4 Revision History
5. 5 Pin Configuration and Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 Handling Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information
   5. 6.5 Electrical Characteristics: V+ = 3 V to 5.5 V
   6. 6.6 Timing Requirements
   7. 6.7 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Feature Description
      1. 7.3.1 Standard and Extended Temperature Measurement Range
      2. 7.3.2 Remote Sensing
   4. 7.4 Device Functional Modes
      1. 7.4.1 SMBus Alert Function
      2. 7.4.2 THERM (Pin 4) and ALERT/THERM2 (Pin 6)
      3. 7.4.3 Sensor Fault
      4. 7.4.4 High-Speed Mode
      5. 7.4.5 Shutdown Mode (SD)
      6. 7.4.6 One-Shot Conversion
      7. 7.4.7 General-Call Reset
   5. 7.5 Programming
      1. 7.5.1 Bus Overview
      2. 7.5.2 Serial Interface
      3. 7.5.3 Serial Bus Address
      4. 7.5.4 Read and Write Operations
      5. 7.5.5 Timeout Function
      6. 7.5.6 Timing Diagrams
   6. 7.6 Register Maps
      1. 7.6.1  Pointer Register
      2. 7.6.2  Temperature Registers
      3. 7.6.3  Limit Registers
      4. 7.6.4  Status Register
      5. 7.6.5  Configuration Register
      6. 7.6.6  Resolution Register
      7. 7.6.7  Conversion Rate Register
      8. 7.6.8  Identification Registers
      9. 7.6.9  Consecutive Alert Register
      10. 7.6.10 THERM Hysteresis Register
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 Filtering
      3. 8.2.3 Application Curves
         1. 8.2.3.1 Series Resistance Cancellation
         2. 8.2.3.2 Differential Input Capacitance
9. 9 Power-Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 Measurement Accuracy and Thermal Considerations
       2. 10.1.2 Layout Considerations
    2. 10.2 Layout Examples
11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
12. 12Mechanical, Packaging, and Orderable Information