ZHCSIX3I July 2009 – December 2018 TMP303
PRODUCTION DATA.
| THERMAL METRIC(1) | TMP303 | UNIT | |
|---|---|---|---|
| DRL (SOT-563) | |||
| 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 210.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 105.0 | °C/W |
| RθJB | Junction-to-board thermal resistance | 87.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 6.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 87.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |