ZHCSUZ6B February 2024 – May 2024 TLV9051-Q1 , TLV9052-Q1
PRODMIX
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TLV9052-Q1 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) |
DGK (VSSOP) |
PW (TSSOP) |
|||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | TBD | TBD | 180.5 | ℃/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | TBD | TBD | 85.2 | ℃/W |
| RθJB | Junction-to-board thermal resistance | TBD | TBD | 120.7 | ℃/W |
| ψJT | Junction-to-top characterization parameter | TBD | TBD | 15.7 | ℃/W |
| ψJB | Junction-to-board characterization parameter | TBD | TBD | 118.1 | ℃/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | ℃/W |