ZHCSHZ7A April 2018 – December 2018 TLV759P
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV759 | UNIT | |
|---|---|---|---|
| DRV (WSON) | |||
| 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 80.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 98.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 44.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 6.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 45.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 20.8 | °C/W |