ZHCSHZ4D April 2018 – October 2023 TLV758P
PRODUCTION DATA
| THERMAL METRIC(1) | TLV758P | UNIT | ||
|---|---|---|---|---|
| DBV (SOT-23) | DRV (WSON) | |||
| 5 PINS | 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 176.9 | 80.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 95.3 | 98.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 45.0 | 44.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 21.0 | 6.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 44.8 | 45.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 20.8 | °C/W |