ZHCSL79D May 2020 – February 2023 TLV7031-Q1 , TLV7032-Q1 , TLV7034-Q1 , TLV7041-Q1 , TLV7042-Q1 , TLV7044-Q1
PRODUCTION DATA
| THERMAL METRIC (1) | TLV7031/TLV7041 | UNIT | ||
|---|---|---|---|---|
| DBV (SOT-23) | DCK (SC70) | |||
| 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 297.2 | 278.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 224.7 | 186.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 200.1 | 113.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 141.2 | 82.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 198.9 | 112.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |