ZHCSGK4E September 2017 – November 2019 TLV7011 , TLV7012 , TLV7021 , TLV7022
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV7011/TLV7021 | UNIT | |||
|---|---|---|---|---|---|
| DPW (X2SON) | DBV (SOT23) | DCK (SC70) | |||
| 5 PINS | 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 497.5 | 306.3 | 278.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 275.5 | 228.4 | 188.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 372.2 | 166.5 | 113.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 55.5 | 138.5 | 82.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 370.3 | 165.3 | 112.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 165.1 | N/A | N/A | °C/W |