ZHCSHG9A January 2018 – April 2018 TLV6703
PRODUCTION DATA.
| THERMAL METRIC (1) | TLV6703 | UNIT | ||
|---|---|---|---|---|
| DDC (SOT) | ||||
| 6 PINS | ||||
| RθJA | Junction-to-ambient thermal resistance | 204.6 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 50.5 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 54.3 | °C/W | |
| ψJT | Junction-to-top characterization parameter | 0.8 | °C/W | |
| ψJB | Junction-to-board characterization parameter | 52.8 | °C/W | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W | |