ZHCSMR5 November 2020 TLV6703-Q1
PRODUCTION DATA
| THERMAL METRIC (1) | DSE (WSON) | UNIT | |
|---|---|---|---|
| 6 PADS | |||
| RθJA | Junction-to-ambient thermal resistance | 194.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 128.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 153.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 11.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 157.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |