ZHCSIO7A August 2018 – December 2018 TLV6001-Q1 , TLV6002-Q1
PRODUCTION DATA.
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TLV6002-Q1 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 131.6 | 186.0 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 71.4 | 73.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 75.4 | 107.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 22.7 | 14.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 74.6 | 105.6 | °C/W |