ZHCSIO7A August 2018 – December 2018 TLV6001-Q1 , TLV6002-Q1
PRODUCTION DATA.
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TLV6001-Q1 | UNIT | |
|---|---|---|---|
| DCK (SC70) | |||
| 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 281.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 91.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 59.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 58.8 | °C/W |