ZHCSHJ3F March 2001 – August 2016 TLV2370 , TLV2371 , TLV2372 , TLV2373 , TLV2374 , TLV2375
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV2375 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | N (PDIP) | PW (TSSOP) | |||
| 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 83 | 55.8 | 115.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 44 | 43.1 | 50.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 40.5 | 35.8 | 60.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 11.5 | 27.9 | 7.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 40.2 | 35.7 | 60.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |