ZHCSFO7A November 2016 – May 2018 TLV170 , TLV2170 , TLV4170
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV2170 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 134.3 | 180 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 72.1 | 55 | °C/W |
| RθJB | Junction-to-board thermal resistance | 60.6 | 130 | °C/W |
| ψJT | Junction-to-top characterization parameter | 18.2 | 5.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 53.8 | 120 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |