ZHCSLZ2B October 2022 – September 2023 TLV1811-Q1 , TLV1812-Q1 , TLV1814-Q1 , TLV1821-Q1 , TLV1822-Q1 , TLV1824-Q1
PRODMIX
| THERMAL METRIC(1) | TLV18x2-Q1 | UNIT | |||||
|---|---|---|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | DDF (SOT-23) | DSG (WSON) | DGK (VSSOP) | |||
| 8 PINS | 8 PINS | 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 136.1 | 187.5 | 170.4 | 79.9 | 178.3 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 76.8 | 76.7 | 90.3 | 100.1 | 66.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 79.7 | 118.1 | 88.1 | 46.4 | 100.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 26.8 | 14.4 | 7.5 | 5.3 | 9.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 78.9 | 116.4 | 87.6 | 46.4 | 98.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | – | – | – | 21.6 | – | °C/W |