ZHCSJD8B August 2018 – January 2020 TLV1805-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | TLV1805-Q1 | UNIT | |
|---|---|---|---|
| DBV (SOT23) | |||
| 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 166.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 104.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 46.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 31.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 46.6 | °C/W |