ZHCSJ09B November 2018 – August 2024 TLV1704-SEP
PRODUCTION DATA
| THERMAL METRIC(1) | TLV1704-SEP | UNIT | |
|---|---|---|---|
| PW (TSSOP) | |||
| 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 128.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 56.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 69.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 9.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 69.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |