ZHCSJZ2F August 2019 – December 2024 THS6222
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | THS6222 | UNIT | ||
|---|---|---|---|---|
| RHF (VQFN) | RGT (VQFN) | |||
| 24 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 43.4 | 48.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 35 | 55.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 21.3 | 22.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 1.3 | 1.6 | °C/W |
| YJB | Junction-to-board characterization parameter | 21.2 | 22.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 9.3 | 8.6 | °C/W |