ZHCSJZ2F August 2019 – December 2024 THS6222
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- YS|0
- RGT|16
- RHF|24
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RGT|16
訂購信息
5.9 Typical Characteristics: VS = 32 V
at TA ≈ 25°C, AV = 10 V/V, RF = 1.24 kΩ, RL = 100 Ω, RS = 2.5 Ω, RADJ = 0 Ω, full-bias mode, and VCM = open (unless otherwise noted)
| VO = 2 VPP |
| AV = 10 V/V |
| VO = 40 VPP |
| VO = 2 VPP |
| f = 1 MHz, RL = 50 Ω |
| f = 1 MHz, VO = 2 VPP |
| VO step = 2 VPP |
| Average of 30 devices | ||
| Output voltage was slammed and IO was pulsed to maintain TJ as close to TA as possible. |
| VO = 2 VPP |
| AV = 15 V/V |
| f = 1 MHz, VO = 2 VPP RL = 50 Ω |
| f = 10 MHz, RL = 50 Ω |
| f = 10 MHz, VO = 2 VPP |
| VO step = 40 VPP |
| Average of 30 devices | ||