ZHCSPA5F August 1999 – July 2024 THS4021 , THS4022
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | THS4022 | UNIT | |
|---|---|---|---|
| DGN (HVSSOP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 52 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 75.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 24.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 4 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 24.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 9.1 | °C/W |