ZHCSRC5K september 2003 – april 2023 THS3091 , THS3095
PRODUCTION DATA
| THERMAL METRIC(1) | THS309x | THS3091 | UNIT | |
|---|---|---|---|---|
| DDA (SO PowerPAD) | DGN (HVSSOP) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 58.4 | 60.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 72.0 | 87.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 32.6 | 32.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 13.2 | 7.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 32.5 | 32.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 17.1 | 17.0 | °C/W |