ZHCSRW5A March 2023 – November 2023 TCAN3413 , TCAN3414
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Parameter Measurement Information
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4 Device Functional Modes
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- D|8
- DDF|8
- DRB|8
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
4 Pin Configuration and Functions
Figure 4-1 DDF Package, 8-Pin SOT(Top View)
Figure 4-3 DRB Package, 8-Pin VSON(Top View)
Figure 4-2 D Package, 8-Pin SOIC(Top View)
Table 4-1 Pin Functions
| Pins | Type(1) | Description | |
|---|---|---|---|
| Name | No. | ||
| TXD | 1 | Digital Input | CAN transmit data input; integrated pull-up |
| GND | 2 | G | Ground connection |
| VCC | 3 | Supply | 3.3 V supply voltage |
| RXD | 4 | Digital Output | CAN receive data output, tri-stated when device powered off |
| SHDN | 5 | Digital Input | Device in ultra-low power shutdown mode if pin is high; integrated pull-down (TCAN3414 only) |
| VIO | Supply | I/O supply voltage (TCAN3413 only) | |
| CANL | 6 | Bus IO | Low-level CAN bus input/output line |
| CANH | 7 | Bus IO | High-level CAN bus input/output line |
| STB | 8 | Digital Input | Standby input for mode control; integrated pull-up |
| Thermal Pad (VSON only) | — | Connect the thermal pad to any internal PCB ground plane using multiple vias for optimal thermal performance. | |
(1) I = Input, O = Output, I/O =
Input or Output, G = Ground.