SLLSFP9 February 2024 TCAN1465-Q1 , TCAN1469-Q1
ADVANCE INFORMATION
| THERMAL METRIC(1) | TCAN146x | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | DMT (VSON) | DYY(SOT-23) | |||
| 14-PINS | 14-PINS | 14-PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 37.5 | 91.8 | °C/W | |
| RθJC(top) | Junction-to-case (top) thermal resistance | 37.8 | 33.8 | °C/W | |
| RθJB | Junction-to-board thermal resistance | 13.9 | 30.6 | °C/W | |
| ΨJT | Junction-to-top characterization parameter | 0.7 | 0.8 | °C/W | |
| ΨJB | Junction-to-board characterization parameter | 13.9 | 30.4 | °C/W | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 4.7 | n/a | °C/W | |