ZHCSG32B March   2017  – February 2020 TCA9800

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說明
   1.     Device Images
      1.      簡(jiǎn)化原理圖
4. 4 修訂歷史記錄
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
   1.     Pin Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 Timing Requirements
   7. 7.7 Switching Characteristics
   8. 7.8 Typical Characteristics
8. 8 Parameter Measurement Information
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Integrated Current Source
      2. 9.3.2 Ultra-Low Power Consumption
      3. 9.3.3 No Static-Voltage Offset
      4. 9.3.4 Active-High Repeater Enable Input
      5. 9.3.5 Powered Off High Impedance I2C Bus Pins on A-Side
      6. 9.3.6 Powered-Off Back-Power Protection for I2C Bus Pins
      7. 9.3.7 Clock Stretching and Multiple Master Arbitration Support
   4. 9.4 Device Functional Modes
      1. 9.4.1 Device Operation Considerations
         1. 9.4.1.1 B-Side Input Low (VIL/IILC/RILC)
            1. 9.4.1.1.1 VILC & IILC
            2. 9.4.1.1.2 RILC
         2. 9.4.1.2 Input and Output Leakage Current (IEXT-I/IEXT-O)
            1. 9.4.1.2.1 IEXT-I
            2. 9.4.1.2.2 IEXT-O
10. 10Application and Implementation
    1. 10.1 Application Information
       1. 10.1.1 Device Selection Guide
       2. 10.1.2 Special Considerations for the B-side
          1. 10.1.2.1 FET or Pass-Gate Translators
          2. 10.1.2.2 Buffered Translators/Level-shifters
    2. 10.2 Typical Application
       1. 10.2.1 Single Device
          1. 10.2.1.1 Design Requirements
          2. 10.2.1.2 Detailed Design Procedure
          3. 10.2.1.3 Application Curves
       2. 10.2.2 Buffering Without Level-Shifting
          1. 10.2.2.1 Design Requirements
          2. 10.2.2.2 Detailed Design Procedure
          3. 10.2.2.3 Application Curve
       3. 10.2.3 Parallel Device Use Case
          1. 10.2.3.1 Design Requirements
          2. 10.2.3.2 Detailed Design Procedure
          3. 10.2.3.3 Application Curves
       4. 10.2.4 Series Device Use Case
          1. 10.2.4.1 Design Requirements
          2. 10.2.4.2 Detailed Design Procedure
          3. 10.2.4.3 Application Curve
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13器件和文檔支持
    1. 13.1 文檔支持
    2. 13.2 接收文檔更新通知
    3. 13.3 支持資源
    4. 13.4 商標(biāo)
    5. 13.5 靜電放電警告
    6. 13.6 Glossary
14. 14機(jī)械、封裝和可訂購(gòu)信息