ZHCS198B June 2011 – October 2021 SN74LVC2G66-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | SN74LVC2G66-Q1 | UNIT | |
|---|---|---|---|
| DCU (VSSOP) | |||
| 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 204.4 | °C/W |
| RθJCtop | Junction-to-case (top) thermal resistance | 77 | °C/W |
| RθJB | Junction-to-board thermal resistance | 83.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 7.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 82.7 | °C/W |
| RθJCbot | Junction-to-case (bottom) thermal resistance | N/A | °C/W |