ZHCSV61W January 1993 – July 2024 SN54LVC08A , SN74LVC08A
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
Figure 4-1 D, DB, NS, J, W, or PW Package14-Pin SOIC, SSOP, SOP, CDIP, or
TSSOP(Top View)
Figure 4-2 BQA or RGY Package14-Pin WQFN or VQFN(Top View)
Figure 4-3 FK Package20-Pin LCCC(Top View)| PIN | TYPE | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | SOIC, SSOP, SOP, CDIP, TSSOP, VQFN,WQFN | LCCC | ||
| 1A | 1 | 2 | I | Channel 1 input A |
| 1B | 2 | 3 | I | Channel 1 input B |
| 1Y | 3 | 4 | O | Channel 1 output |
| 2A | 4 | 6 | I | Channel 2 input A |
| 2B | 5 | 8 | I | Channel 2 input B |
| 2Y | 6 | 9 | O | Channel 2 output |
| GND | 7 | 10 | Ground | Ground |
| 3Y | 8 | 12 | O | Channel 3 output |
| 3A | 9 | 13 | I | Channel 3 input A |
| 3B | 10 | 14 | I | Channel 3 input B |
| 4Y | 11 | 16 | O | Channel 4 output |
| 4A | 12 | 18 | I | Channel 4 input A |
| 4B | 13 | 19 | I | Channel 4 input B |
| VCC | 14 | 20 | Power | Positive supply |
| Thermal Information(1) | — | The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply. | ||
| NC(2) | — | 1 | — | No connect |
| 5 | ||||
| 7 | ||||
| 11 | ||||
| 15 | ||||
| 17 | ||||