ZHCSV59D September 2003 – May 2024 SN74LVC00A-Q1
PRODUCTION DATA
Figure 3-1 SN74LVC00A-Q1 D or PW Package, 14-Pin SOIC or TSSOP (Top View)| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| 1A | 1 | I | Channel 1, Input A |
| 1B | 2 | I | Channel 1, Input B |
| 1Y | 3 | O | Channel 1, Output Y |
| 2A | 4 | I | Channel 2, Input A |
| 2B | 5 | I | Channel 2, Input B |
| 2Y | 6 | O | Channel 2, Output Y |
| GND | 7 | — | Ground |
| 3Y | 8 | O | Channel 3, Output Y |
| 3A | 9 | I | Channel 3, Input A |
| 3B | 10 | I | Channel 3, Input B |
| 4Y | 11 | O | Channel 4, Output Y |
| 4A | 12 | I | Channel 4, Input A |
| 4B | 13 | I | Channel 4, Input B |
| VCC | 14 | — | Positive Supply |
| Thermal Information | — | The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply. | |