ZHCSRP1B October 2020 – May 2021 SN74HCS595
PRODUCTION DATA
| THERMAL METRIC(1) | SN74HCS595 | UNIT | ||||
|---|---|---|---|---|---|---|
| PW (TSSOP) | D (SOIC) | BQB (WQFN) | DYY (SOT-23) | |||
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 141.2 | 122.2 | 108.4 | 186.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 78.8 | 80.9 | 77.3 | 109.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 85.8 | 80.6 | 74.4 | 111.0 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 27.7 | 40.4 | 12.6 | 18.0 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 85.5 | 80.3 | 74.5 | 110.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | 54.3 | N/A | °C/W |