ZHCSNM4D March 2021 – January 2023 SN74HCS273
PRODUCTION DATA
| THERMAL METRIC(1) | SN74HCS273 | UNIT | |||
|---|---|---|---|---|---|
| RKS (VQFN) | PW (TSSOP) | DGS (VSSOP) | |||
| 20 PINS | 20 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 83.2 | 134.9 | 130.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 82.6 | 74.6 | 68.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 57.4 | 86 | 85.4 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 14.5 | 22.5 | 10.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 56.4 | 85.6 | 85.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 40.0 | N/A | N/A | °C/W |