ZHCSLY3B August 2020 – December 2021 SN74HCS164
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- BQA|14
訂購信息
5 Pin Configuration and Functions
D, PW or DYY Package16-Pin SOIC, TSSOP or SOT-23-THIN
Top View
BQA Package16-Pin WQFN
Top View
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| SOIC, TSSOP or SOT-23-THIN NO. | NAME | ||
| 1 | A | I | Serial input A |
| 2 | B | I | Serial input B |
| 3 | QA | O | Parallel output A |
| 4 | QB | O | Parallel output B |
| 5 | QC | O | Parallel output C |
| 6 | QD | O | Parallel output D |
| 7 | GND | — | Ground |
| 8 | CLK | I | Clock, rising edge triggered |
| 9 | CLR | I | Clear 1 Active-Low |
| 10 | QE | O | Parallel output E |
| 11 | QF | O | Parallel output F |
| 12 | QG | O | Parallel output G |
| 13 | QH | O | Parallel output H |
| 14 | VCC | — | Positive supply |
| Thermal Pad(1) | — | The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply | |
(1) BQA Package only.