ZHCSNO5C June 2020 – December 2021 SN74HCS164-Q1
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- BQA|14
訂購信息
5 Pin Configuration and Functions
Figure 5-1 D, PW, or DYY
Package16-Pin SOIC, TSSOP or SOT
Top View
Figure 5-2 BQA Package16-Pin WQFN
Top View
Table 5-1 Pin Functions
| PIN | TYPE(2) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| A | 1 | I | Serial input A |
| B | 2 | I | Serial input B |
| QA | 3 | O | Parallel output A |
| QB | 4 | O | Parallel output B |
| QC | 5 | O | Parallel output C |
| QD | 6 | O | Parallel output D |
| GND | 7 | — | Ground |
| CLK | 8 | I | Clock, rising edge triggered |
| CLR | 9 | I | Clear 1 Active-Low |
| QE | 10 | O | Parallel output E |
| QF | 11 | O | Parallel output F |
| QG | 12 | O | Parallel output G |
| QH | 13 | O | Parallel output H |
| VCC | 14 | — | Positive supply |
| Thermal Pad(1) | — | The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply. | |
(1) BQA Package only.
(2) I = input, O = output