ZHCSJ94K March 1996 – February 2024 SN74HC4066
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | SN74HC4066 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | |||
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 127.8 | 150.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 81.8 | 78.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 84.2 | 93.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 39.5 | 24.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 83.7 | 93.1 | °C/W |