ZHCSPV7F January 1996 – June 2022 SN54HC175 , SN74HC175
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC | D (SOIC) | DB (SSOP) | N (PDIP) | NS (SO) | PW (TSSOP) | UNIT | |
|---|---|---|---|---|---|---|---|
| 16 PINS | 16 PINS | 16 PINS | 16 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance(1) | 117.2 | 102.7 | 60.5 | 88.6 | 137.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 77.2 | 48.6 | 48 | 46.2 | 75.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 75.6 | 54.4 | 40.5 | 50.8 | 82.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 38.1 | 11.6 | 27.4 | 13.4 | 25.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 75.3 | 53.6 | 40.3 | 50.4 | 81.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | N/A | °C/W |