ZHCSWU3F August 1995 – February 2025 SN54AC11 , SN74AC11
PRODUCTION DATA
- 1
- 1 特性
- 2 說明
- 3 Pin Configuration and Functions
- 4 Specifications
- 5 Parameter Measurement Information
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機械數(shù)據(jù) (封裝 | 引腳)
- D|14
- PW|14
- DB|14
- BQA|14
- N|14
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- BQA|14
訂購信息
3 Pin Configuration and Functions
Figure 3-1 SN54AC11 J or W Package;
SN74AC11 D, DB, N, NS, or PW Package (Top View)
Figure 3-3 SN54AC11 FK Package (Top
View)Figure 3-2 BQA Package, 14-Pin WQFN (Top View)
| PIN | I/O(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| 1A | 1 | Input | Channel 1, Input A |
| 1B | 2 | Input | Channel 1, Input B |
| 2A | 3 | Input | Channel 2, Input A |
| 2B | 4 | Input | Channel 2, Input B |
| 2C | 5 | Input | Channel 2, Input C |
| 2Y | 6 | Output | Channel 2, Output Y |
| GND | 7 | — | Ground |
| 3Y | 8 | Output | Channel 3, Output Y |
| 3C | 9 | Input | Channel 3, Input A |
| 3B | 10 | Input | Channel 3, Input B |
| 3A | 11 | Input | Channel 3, Input C |
| 1Y | 12 | Output | Channel 1, Output Y |
| 1C | 13 | Input | Channel 1, Input C |
| VCC | 14 | — | Positive Supply |
| Thermal Pad(2) | — | The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply. | |
(1) I = input, O = output, P = power,
FB = feedback, GND = ground, N/A = not applicable
(2) BQA package only