ZHCSJ17H November 2002 – November 2018 SN65HVD233 , SN65HVD234 , SN65HVD235
PRODUCTION DATA.
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| PARAMETERS | TEST CONDITIONS | VALUE | UNIT | |
|---|---|---|---|---|
| RθJA | Junction-to-ambient thermal resistance(1) | Low-K(2) board, no air flow | 185 | °C/W |
| High-K(3) board, no air flow | 101 | |||
| RθJB | Junction-to-board thermal resistance | High-K(3) board, no air flow | 82.8 | °C/W |
| RθJC | Junction-to-case thermal resistance | 26.5 | °C/W | |
| P(AVG) | Average power dissipation | RL = 60 Ω, RS at 0 V, input to D a 1-MHz 50% duty
cycle square wave VCC at 3.3 V, TA = 25°C |
36.4 | mW |
| T(SD) | Thermal shutdown junction temperature | 170 | °C | |