ZHCSRK3F March 1984 – April 2021 SN54HC03 , SN74HC03
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | SN74HC03 | UNIT | ||||
|---|---|---|---|---|---|---|
| D (SOIC) | N (PDIP) | NS (SOP) | PW (TSSOP) | |||
| 14 PINS | 14 PINS | 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 133.6 | 66.0 | 122.6 | 151.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 89 | 53.7 | 81.8 | 79.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 89.5 | 45.7 | 83.8 | 94.7 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 45.5 | 33.3 | 45.4 | 25.2 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 89.1 | 45.5 | 83.4 | 94.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | N/A | °C/W |