ZHCSWU3F August 1995 – February 2025 SN54AC11 , SN74AC11
PRODUCTION DATA
請參考 PDF 數據表獲取器件具體的封裝圖。
Figure 3-1 SN54AC11 J or W Package;
SN74AC11 D, DB, N, NS, or PW Package (Top View)
Figure 3-3 SN54AC11 FK Package (Top
View)| PIN | I/O(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| 1A | 1 | Input | Channel 1, Input A |
| 1B | 2 | Input | Channel 1, Input B |
| 2A | 3 | Input | Channel 2, Input A |
| 2B | 4 | Input | Channel 2, Input B |
| 2C | 5 | Input | Channel 2, Input C |
| 2Y | 6 | Output | Channel 2, Output Y |
| GND | 7 | — | Ground |
| 3Y | 8 | Output | Channel 3, Output Y |
| 3C | 9 | Input | Channel 3, Input A |
| 3B | 10 | Input | Channel 3, Input B |
| 3A | 11 | Input | Channel 3, Input C |
| 1Y | 12 | Output | Channel 1, Output Y |
| 1C | 13 | Input | Channel 1, Input C |
| VCC | 14 | — | Positive Supply |
| Thermal Pad(2) | — | The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply. | |