ZHCSCT4A September 2014 – January 2017 REF1925 , REF1930 , REF1933 , REF1941
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Parameter Measurement Information
- 9 Detailed Description
- 10Applications and Implementation
- 11Power-Supply Recommendations
- 12Layout
- 13器件和文檔支持
- 14機械、封裝和可訂購信息
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- DDC|5
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
12 Layout
12.1 Layout Guidelines
Figure 54 shows an example of a PCB layout for a data acquisition system using the REF1930. Some key considerations are:
- Connect low-ESR, 0.1-μF ceramic bypass capacitors at VIN, VREF, and VBIAS of the REF1930.
- Decouple other active devices in the system per the device specifications.
- Using a solid ground plane helps distribute heat and reduces electromagnetic interference (EMI) noise pickup.
- Place the external components as close to the device as possible. This configuration prevents parasitic errors (such as the Seebeck effect) from occurring.
- Minimize trace length between the reference and bias connections to the INA and ADC to reduce noise pickup.
- Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible and only make perpendicular crossings when absolutely necessary.
12.2 Layout Example
Figure 54. Layout Example