SLES254D April 2010 – July 2015 PCM1753-Q1 , PCM1754-Q1
PRODUCTION DATA.
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Supply voltage | VCC | –0.3 | 6.5 | V |
| Ground voltage differences | AGND, DGND | –0.1 | 0.1 | V |
| Input voltage | –0.3 | 6.5 | V | |
| Input current (any pins except supplies) | –10 | 10 | mA | |
| Ambient temperature under bias | –40 | 105 | °C | |
| Junction temperature | 150 | °C | ||
| Storage temperature, Tstg | –55 | 150 | °C | |
| VALUE | UNIT | ||||
|---|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per AEC Q100–002(1) | ±2000 | V | |
| Charged device model (CDM), per AEC Q100–011 | Corner pins (1, 8, 9, and 16) | ±750 | |||
| Other pins | ±500 | ||||
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VCC | Voltage range | 4.5 | 5 | 5.5 | VDC |
| THERMAL METRIC(1) | PCM175x-Q1 | UNIT | |
|---|---|---|---|
| DBQ (SSOP) | |||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 111.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 57.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 55.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 13.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 54.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| Resolution | 24 | Bits | |||||
| DATA FORMAT | |||||||
| fS | Sampling frequency | 5 | 200 | kHz | |||
| System clock frequency(3) | 128 fS
192 fS 256 fS 384 fS 512 fS 768 fS 1152 fS |
kHz | |||||
| DIGITAL INPUT/OUTPUT | |||||||
| Logic family | TTL compatible | ||||||
| VIH | Input logic level, high | 2 | VDC | ||||
| VIL | Input logic level, low | 0.8 | |||||
| IIH | Input logic current, high (SCK, BCK, DATA, and LRCK pins) | VIN = VCC | 10 | µA | |||
| IIL | Input logic current, low (SCK, BCK, DATA, and LRCK pins) | VIN = 0 V | –10 | µA | |||
| IIH | Input logic current, high (TEST, DEMP, MUTE, and FMT pins) | VIN = VCC | 65 | 100 | µA | ||
| IIL | Input logic current, low (TEST, DEMP, MUTE, and FMT pins) | VIN = 0 V | –10 | µA | |||
| VOH | Output logic level, high (ZEROA pin) | IOH = –1 mA | 2.4 | VDC | |||
| VOL | Output logic level, low (ZEROA pin) | IOL = 1 mA | 0.4 | VDC | |||
| DYNAMIC PERFORMANCE(1)(2) | |||||||
| THD+N at VOUT = 0 dB | fS = 44.1 kHz | 0.00% | 0.01% | ||||
| fS = 96 kHz | 0.00% | ||||||
| fS = 192 kHz | 0.00% | ||||||
| THD+N at VOUT = -60 dB | fS = 44.1 kHz | 0.65% | |||||
| fS = 96 kHz | 0.80% | ||||||
| fS = 192 kHz | 0.95% | ||||||
| Dynamic range | EIAJ, A-weighted, fS = 44.1 kHz | 100 | 106 | dB | |||
| A-weighted, fS = 96 kHz | 104 | ||||||
| A-weighted, fS = 192 kHz | 102 | ||||||
| Signal-to-noise ratio | EIAJ, A-weighted, fS = 44.1 kHz | 100 | 106 | dB | |||
| A-weighted, fS = 96 kHz | 104 | ||||||
| A-weighted, fS = 192 kHz | 102 | ||||||
| Channel separation | fS = 44.1 kHz | 97 | 103 | dB | |||
| fS = 96 kHz | 101 | ||||||
| fS = 192 kHz | 100 | ||||||
| Level linearity error | VOUT = -90 dB | ±0.5 | dB | ||||
| DC ACCURACY | |||||||
| Gain error | ±1 | ±6 | % of FSR | ||||
| Gain mismatch, channel-to-channel | ±1 | ±3 | % of FSR | ||||
| Bipolar zero error | VOUT = 0.5 VCC at BPZ | ±30 | ±60 | mV | |||
| ANALOG OUTPUT | |||||||
| Output voltage | Full scale (0 dB) | 80% of VCC | VPP | ||||
| Center voltage | 50% of VCC | VDC | |||||
| Load impedance | AC-coupled load | 5 | kΩ | ||||
| DIGITAL FILTER PERFORMANCE | |||||||
| FILTER CHARACTERISTICS (SHARP ROLLOFF) | |||||||
| Pass band | ±0.04 dB | 0.454 fS | |||||
| Stop band | 0.546 fs | ||||||
| Pass-band ripple | ±0.04 | dB | |||||
| Stop-band attenuation | Stop band = 0.546 fS | –50 | dB | ||||
| ANALOG FILTER PERFORMANCE | |||||||
| Frequency response | At 20 kHz | –0.03 | dB | ||||
| At 44 kHz | –0.20 | ||||||
| POWER SUPPLY REQUIREMENTS(2) | |||||||
| VCC | Voltage range | 4.5 | 5 | 5.5 | VDC | ||
| ICC | Supply current | fS = 44.1 kHz | 16 | 21 | mA | ||
| fS = 96 kHz | 25 | ||||||
| fS = 192 kHz | 30 | ||||||
| Power dissipation | fS = 44.1 kHz | 80 | 105 | mW | |||
| fS = 96 kHz | 125 | ||||||
| fS = 192 kHz | 150 | ||||||
| TEMPERATURE RANGE | |||||||
| Operation temperature | –40 | 105 | °C | ||||
| RθJA | Thermal resistance | 16-pin SSOP | 115 | °C/W | |||
| MIN | NOM | MAX | UNIT | |||
|---|---|---|---|---|---|---|
| t(SCKH) | System clock pulse duration, high | See Figure 20. | 7 | ns | ||
| t(SCKL) | System clock pulse duration, low | 7 | ns | |||
| t(SCY) | System clock pulse cycle time | See (1) | ns | |||
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| t(BCY) | BCK pulse cycle time | See Figure 22. | 1/(32 fS) 1/(48 fS) 1/(64 fS)(1) |
ns | |
| t(BCH) | BCK high–level time | 35 | ns | ||
| t(BCL) | BCK low–level time | 35 | ns | ||
| t(BL) | BCK rising edge to LRCK edge | 10 | ns | ||
| t(LB) | LRCK falling edge to BCK rising edge | 10 | ns | ||
| t(DS) | DATA setup time | 10 | ns | ||
| t(DH) | DATA hold time | 10 | ns | ||
| MIN | NOM | MAX | UNIT | |||
|---|---|---|---|---|---|---|
| t(MCY) | MC pulse cycle time | See Figure 1. | 100 | ns | ||
| t(MCL) | MC low-level time | 50 | ns | |||
| t(MCH) | MC high-level time | 50 | ns | |||
| t(MCH) | ML high-level time | See (2) | ns | |||
| t(MLS) | ML falling edge to MC rising edge | 20 | ns | |||
| t(MLH) | ML hold time(1) | 20 | ns | |||
| t(MDH) | MD hold time | 15 | ns | |||
| t(MDS) | MD setup time | 20 | ns | |||
seconds (min); fS: sampling rate.
Figure 1. Control Interface Timing

| Frequency response | Sharp rolloff | |

| Frequency response | Slow rolloff | |

| fS = 32 kHz |

| fS = 44.1 kHz |

| fS = 48 kHz |

| Pass-band ripple | Sharp rolloff | |

| Transition characteristics | Slow rolloff | |

| fS = 32 kHz |

| fS = 44.1 kHz |

| fS = 48 kHz |
Figure 12. Total Harmonic Distortion + Noise vs Supply Voltage
Figure 14. Signal-to-Noise Ratio vs Supply Voltage
Figure 13. Dynamic Range vs Supply Voltage
Figure 15. Channel Separation vs Supply Voltage
Figure 16. Total Harmonic Distortion + Noise vs Free-Air Temperature
Figure 18. Signal-to-Noise Ratio vs Free-Air Temperature
Figure 17. Dynamic Range vs Free-Air Temperature
Figure 19. Channel Separation vs Free-Air Temperature