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ZHCS780B March 2012 – March 2016 PCA9515B

PRODUCTION DATA.

封裝選項(xiàng)

機(jī)械數(shù)據(jù) (封裝 | 引腳)

DGK|8
- MPDS028E

散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)

訂購(gòu)信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) ⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage		–0.5	7	V
V_I	Enable input voltage ⁽²⁾		–0.5	7	V
V_I/O	I²C bus voltage⁽²⁾		–0.5	7	V
I_IK	Input clamp current	V_I < 0		–50	mA
I_OK	Output clamp current	V_O < 0		–50	mA
I_O	Continuous output current			±50	mA
	Continuous current through V_CC or GND			±100	mA
T_stg	Storage temperature		–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±1000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

			MIN	MAX	UNIT
V_CC	Supply voltage		2.3	3.6	V
V_IH	High-level input voltage	SDA and SCL inputs	0.7 × V_CC	5.5	V
V_IH	High-level input voltage	EN input	2	5.5	V
V_IL ⁽¹⁾	Low-level input voltage	SDA and SCL inputs	–0.5	0.3 × V_CC	V
V_IL ⁽¹⁾	Low-level input voltage	EN input	–0.5	0.8	V
V_ILc ⁽¹⁾	SDA and SCL low-level input voltage contention		–0.5	0.4	V
I_OL	Low-level output current	V_CC = 2.3 V		6	mA
I_OL	Low-level output current	V_CC = 3 V		6	mA
T_A	Operating free-air temperature		–40	85	°C

(1) V_IL specification is for the EN input and the first low level seen by the SDAx and SCLx lines. V_ILc is for the second and subsequent low levels seen by the SDAx and SCLx lines. V_ILc must be at least 70 mV below V_OL.

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		PCA9515B	UNIT
		DGK (VSSOP)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance⁽²⁾	170.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	62.9	°C/W
R_θJB	Junction-to-board thermal resistance	91.6	°C/W
ψ_JT	Junction-to-top characterization parameter	9.5	°C/W
ψ_JB	Junction-to-board characterization parameter	90.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

(2) The package thermal impedance is calculated in accordance with JESD 51-7.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER			TEST CONDITIONS		V_CC	MIN	TYP⁽¹⁾	MAX	UNIT
V_IK	Input diode clamp voltage		I_I = –18 mA		2.3 V to 3.6 V	–1.2			V
V_OL	Low-level output voltage	SDAx, SCLx	I_OL = 20 μA or 6 mA		2.3 V to 3.6 V	0.47	0.52	0.6	V
V_OL – V_ILc	Low-level input voltage below low-level output voltage	SDAx, SCLx	guaranteed by design		2.3 V to 3.6 V		120		mV
I_CC	Quiescent supply current		Both channels high, SDAx = SCLx = V_CC		2.7 V		0.5	3	mA
			Both channels high, SDAx = SCLx = V_CC		3.6 V		0.5	3
			Both channels low, SDA0 = SCL0 = GND and SDA1 = SCL1 = open; or SDA0 = SCL0 = open and SDA1 = SCL1 = GND		2.7 V		1	4
					3.6 V		1	4
			In contention, SDAx = SCLx = GND		2.7 V		1	4
			In contention, SDAx = SCLx = GND		3.6 V		1	4
I_I	Input current	SDAx, SCLx	V_I = 3.6 V		2.3 V to 3.6 V			±1	μA
		SDAx, SCLx	V_I = 0.2 V					3
		EN	V_I = V_CC					±1
		EN	V_I = 0.2 V				–10	–20
I_off	Leakage current	SDAx, SCLx	V_I = 3.6 V	EN = L or H	0 V			0.5	μA
I_off	Leakage current	SDAx, SCLx	V_I = GND	EN = L or H	0 V			0.5	μA
I_I(ramp)	Leakage current during power up	SDAx, SCLx	V_I = 3.6 V	EN = L or H	0 V to 2.3 V			1	μA
C_in	Input capacitance	EN	V_I = 3 V or GND		3.3 V		7	9	pF
C_in	Input capacitance	SDAx, SCLx	V_I = 3 V or GND	EN = H	3.3 V		7	9	pF

(1) All typical values are at nominal supply voltage (V_CC = 2.5 V or 3.3 V) and T_A = 25°C.

6.6 Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)

		V_CC	MIN	UNIT
t_su	Setup time, EN↑ before Start condition	2.5 V ± 0.2 V	100	ns
t_su	Setup time, EN↑ before Start condition	3.3 V ± 0.3 V	100	ns
t_h	Hold time, EN↓ after Stop condition	2.5 V ± 0.2 V	130	ns
t_h	Hold time, EN↓ after Stop condition	3.3 V ± 0.3 V	100	ns

6.7 Switching Characteristics

over recommended operating free-air temperature range, C_L ≤ 100 pF (unless otherwise noted)

PARAMETER		FROM (INPUT)	TO (OUTPUT)	V_CC	MIN	TYP⁽¹⁾	MAX	UNIT
t_PZL	Propagation delay time⁽²⁾	SDA0, SCL0 or SDA1, SCL1	SDA1, SCL1 or SDA0, SCL0	2.5 V ± 0.2 V	45	82	130	ns
t_PZL				3.3 V ± 0.3 V	45	68	120
t_PLZ				2.5 V ± 0.2 V	33	113	190
t_PLZ				3.3 V ± 0.3 V	33	102	180
t_tHL	Output transition time⁽²⁾ (SDAx, SCLx)	80%	20%	2.5 V ± 0.2 V		57		ns
t_tHL		80%	20%	3.3 V ± 0.3 V		58
t_tLH		20%	80%	2.5 V ± 0.2 V		148
t_tLH		20%	80%	3.3 V ± 0.3 V		147

(1) All typical values are at nominal supply voltage (V_CC = 2.5 V or 3.3 V) and T_A = 25°C.

(2) Different load resistance and capacitance alter the RC time constant, thereby changing the propagation delay and transition times.

6.8 Typical Characteristics

Figure 1. Output Low Voltage (V_OL) vs. Output Low Current (I_OL) for SCL0 at Different V_CC

Figure 2. Output Low Voltage (V_OL) vs. Output Low Current (I_OL) for SCL0 at Different Temperatures for V_CC= 5 V