ZHCSGF0D July 2017 – October 2019 MCP6291 , MCP6292 , MCP6294
PRODUCTION DATA.
| THERMAL METRIC(1) | MCP6292 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | DDF (SOT-23) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 157.6 | 201.2 | 184.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 104.6 | 85.7 | 112.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 99.7 | 122.9 | 99.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 55.6 | 21.2 | 18.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 99.2 | 121.4 | 99.3 | °C/W |