ZHCSK37 August   2019 LP8867C-Q1 , LP8869C-Q1

PRODUCTION DATA.  

1. 1 特性
   1.     簡化原理圖
2. 2 應(yīng)用
3. 3 說明
   1.     系統(tǒng)效率
4. 4 修訂歷史記錄
5. 5 Device Comparison Table
6. 6 Pin Configuration and Functions
   1.     Pin Functions
7. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Electrical Characteristics
   6. 7.6  Internal LDO Electrical Characteristics
   7. 7.7  Protection Electrical Characteristics
   8. 7.8  Current Sinks Electrical Characteristics
   9. 7.9  PWM Brightness Control Electrical Characteristics
   10. 7.10 Boost and SEPIC Converter Characteristics
   11. 7.11 Logic Interface Characteristics
   12. 7.12 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Integrated DC-DC Converter
         1. 8.3.1.1 DC-DC Converter Parameter Configuration
            1. 8.3.1.1.1 Switching Frequency
            2. 8.3.1.1.2 Spread Spectrum and External SYNC
            3. 8.3.1.1.3 Recommended Component Value and Internal Parameters
            4. 8.3.1.1.4 DC-DC Converter Switching Current Limit
            5. 8.3.1.1.5 DC-DC Converter Light Load Mode
         2. 8.3.1.2 Adaptive Voltage Control
            1. 8.3.1.2.1 Using Two-Divider
            2. 8.3.1.2.2 Using T-Divider
            3. 8.3.1.2.3 Feedback Capacitor
      2. 8.3.2 Internal LDO
      3. 8.3.3 LED Current Sinks
         1. 8.3.3.1 LED Output Configuration
         2. 8.3.3.2 LED Current Setting
         3. 8.3.3.3 Brightness Control
      4. 8.3.4 Protection and Fault Detections
         1. 8.3.4.1 Supply Fault and Protection
            1. 8.3.4.1.1 VIN Undervoltage Fault (VIN_UVLO)
            2. 8.3.4.1.2 VIN Overvoltage Fault (VIN_OVP)
         2. 8.3.4.2 Boost Fault and Protection
            1. 8.3.4.2.1 Boost Overvoltage Fault (BST_OVP)
            2. 8.3.4.2.2 SW Overvoltage Fault (SW_OVP)
         3. 8.3.4.3 LED Fault and Protection
            1. 8.3.4.3.1 LED Open Fault (LED_OPEN)
            2. 8.3.4.3.2 LED Short Fault (LED_SHORT)
         4. 8.3.4.4 Thermal Fault and Protection (TSD)
         5. 8.3.4.5 Overview of the Fault and Protection Schemes
   4. 8.4 Device Functional Modes
      1. 8.4.1 STANDBY State
      2. 8.4.2 SOFT START State
      3. 8.4.3 BOOST START State
      4. 8.4.4 NORMAL State
      5. 8.4.5 FAULT RECOVERY State
      6. 8.4.6 State Diagram and Timing Diagram for Start-up and Shutdown
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Applications
      1. 9.2.1 Typical Application for 4 LED Strings
         1. 9.2.1.1 Design Requirements
         2. 9.2.1.2 Detailed Design Procedure
            1. 9.2.1.2.1 Inductor Selection
            2. 9.2.1.2.2 Output Capacitor Selection
            3. 9.2.1.2.3 Input Capacitor Selection
            4. 9.2.1.2.4 LDO Output Capacitor
            5. 9.2.1.2.5 Diode
         3. 9.2.1.3 Application Curves
      2. 9.2.2 SEPIC Mode Application
         1. 9.2.2.1 Design Requirements
         2. 9.2.2.2 Detailed Design Procedure
            1. 9.2.2.2.1 Inductor
            2. 9.2.2.2.2 Diode
            3. 9.2.2.2.3 Capacitor C1
         3. 9.2.2.3 Application Curves
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
12. 12器件和文檔支持
    1. 12.1 器件支持
       1. 12.1.1 開發(fā)支持
    2. 12.2 文檔支持
       1. 12.2.1 相關(guān)文檔
    3. 12.3 接收文檔更新通知
    4. 12.4 社區(qū)資源
    5. 12.5 商標(biāo)
    6. 12.6 靜電放電警告
    7. 12.7 Glossary
13. 13機(jī)械、封裝和可訂購信息