ZHCSIQ2B September 2018 – January 2019 LP5030 , LP5036
PRODUCTION DATA.
| THERMAL METRIC(1) | LP5030 or LP5036 | UNIT | |
|---|---|---|---|
| RJV (QFN) | |||
| 46 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 35.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 29.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 16.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 16.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 6.3 | °C/W |