ZHCSSD8F april 2000 – july 2023 LP2980-ADJ
PRODUCTION DATA
| THERMAL METRIC (2) (1) | Legacy Chip | New Chip | UNIT | |
|---|---|---|---|---|
| DBV (SOT23-5) | DBV (SOT23-5) | |||
| 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 205.4 | 178.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 78.8 | 77.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 46.7 | 47.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 8.3 | 15.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 46.3 | 46.9 | °C/W |