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ZHCS548S December 2009 – July 2017 LMZ14203

PRODUCTION DATA.

封裝選項(xiàng)

機(jī)械數(shù)據(jù) (封裝 | 引腳)

NDW|7
- MMSF024

散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)

訂購(gòu)信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾

	MIN	MAX	UNIT
VIN, RON to GND	–0.3	43.5	V
EN, FB, SS to GND	–0.3	7	V
Junction Temperature		150	°C
Peak Reflow Case Temperature (30 sec)		245	°C
Storage Temperature	–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) For soldering specifications, refer to the following document: Absolute Maximum Ratings for Soldering (SNOA549).

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

	MIN	MAX	UNIT
V_IN	6	42	V
EN	0	6.5	V
Operation Junction Temperature	−40	125	°C

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Ratings are conditions under which operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.

6.4 Thermal Information

THERMAL METRIC⁽¹⁾			LMZ14203	UNIT
			NDW (TO-PMOD)
			7 PINS
R_θJA	Junction-to-ambient thermal resistance	4-layer JEDEC Printed Circuit Board, No air flow	19.3	°C/W
R_θJA	Junction-to-ambient thermal resistance	2-layer JEDEC Printed Circuit Board, No air flow	21.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	No air flow	1.9	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

T_J = 25°C unless otherwise noted. Minimum and maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at T_J = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: V_IN = 24 V, Vout = 3.3 V

PARAMETER		TEST CONDITIONS		MIN⁽¹⁾	TYP⁽²⁾	MAX⁽¹⁾	UNIT
SYSTEM PARAMETERS
Enable Control⁽³⁾
V_EN	EN threshold trip point	V_EN rising	T_J = 25°C		1.18		V
V_EN	EN threshold trip point	V_EN rising	over the junction temperature (T_J) range of –40°C to +125°C	1.1		1.25	V
V_EN-HYS	EN threshold hysteresis	V_EN falling			90		mV
Soft Start
I_SS	SS source current	V_SS = 0V	T_J = 25°C		8		µA
I_SS	SS source current	V_SS = 0V	over the junction temperature (T_J) range of –40°C to +125°C	5		11	µA
I_SS-DIS	SS discharge current				–200		µA
Current Limit
I_CL	Current limit threshold	DC average V_IN= 12 V to 24 V	T_J = 25°C		4.2		A
I_CL	Current limit threshold	DC average V_IN= 12 V to 24 V	over the junction temperature (T_J) range of –40°C to +125°C	3.2		5.25	A
ON/OFF Timer
t_ON-MIN	ON timer minimum pulse width				150		ns
t_OFF	OFF timer pulse width				260		ns
Regulation and Overvoltage Comparator
V_FB	In-regulation feedback voltage	V_SS > 0.8 V T_J = –40°C to 125°C I_O = 3 A	T_J = 25°C		0.804		V
		V_SS > 0.8 V T_J = –40°C to 125°C I_O = 3 A	over the junction temperature (T_J) range of –40°C to +125°C	0.784		0.825	V
		V_SS > 0.8 V T_J = 25°C I_O = 10 mA		0.786	0.802	0.818	V
V_FB-OV	Feedback overvoltage protection threshold				0.92		V
I_FB	Feedback input bias current				5		nA
I_Q	Nonswitching Input Current	V_FB= 0.86 V			1		mA
I_SD	Shut Down Quiescent Current	V_EN= 0 V			25		μA
Thermal Characteristics
T_SD	Thermal Shutdown	Rising			165		°C
T_SD-HYST	Thermal shutdown hysteresis	Falling			15		°C
PERFORMANCE PARAMETERS
ΔV_O	Output Voltage Ripple				8		mV _PP
ΔV_O/ΔV_IN	Line Regulation	V_IN = 12 V to 42 V, I_O= 3 A			0.01%
ΔV_O/I_OUT	Load Regulation	V_IN = 24 V			1.5		mV/A
η	Efficiency	V_IN = 24 V V_O = 3.3 V I_O = 1 A			92%
η	Efficiency	V_IN = 24 V V_O = 3.3 V I_O = 3 A			85%

(1) Minimum and maximum limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).

(2) Typical numbers are at 25°C and represent the most likely parametric norm.

(3) EN 55022:2006, +A1:2007, FCC Part 15 Subpart B: 2007. See AN-2024 and layout for information on device under test.

6.6 Typical Characteristics

Unless otherwise specified, the following conditions apply: V_IN = 24 V; C_IN = 10-µF X7R Ceramic; C_O = 100-µF X7R Ceramic; T_A = 25°C for efficiency curves and waveforms.