ZHCSPF6B february 2022 – may 2023 LMQ66410 , LMQ66420 , LMQ66430
PRODUCTION DATA
| THERMAL METRIC (1) | LMQ664x0 | UNIT | |
|---|---|---|---|
| VQFN | |||
| 15 PINS | |||
| RθJA | Junction-to-ambient thermal resistance for LMQ66430-2EVM | 45 | °C/W |
| RθJA | Junction-to-ambient thermal resistance | 66.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 53.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 26.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 25.9 | °C/W |