ZHCS587H July   2011  – January 2016 LMP90077 , LMP90078 , LMP90079 , LMP90080

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
4. 4 修訂歷史記錄
5. 5 說(shuō)明 （續(xù)）
6. 6 Device Comparison Table
7. 7 Pin Configuration and Functions
8. 8 Specifications
   1. 8.1  Absolute Maximum Ratings
   2. 8.2  ESD Ratings
   3. 8.3  Recommended Operating Conditions
   4. 8.4  Thermal Information
   5. 8.5  Electrical Characteristics
   6. 8.6  Timing Requirements
   7. 8.7  Timing Requirements - CSB Timing
   8. 8.8  Timing Requirements - SCLK and SDI Timing
   9. 8.9  Timing Requirements - SDO Timing With DOD1
   10. 8.10 Timing Requirements - SDO Timing with DOD2
   11. 8.11 Timing Requirements - SDO and DRDYB Timing
   12. 8.12 Typical Characteristics
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Functional Block Diagram
   3. 9.3 Feature Description
      1. 9.3.1 Calibration
         1. 9.3.1.1 Background Calibration
            1. 9.3.1.1.1 Types of Background Calibration:
            2. 9.3.1.1.2 Using Background Calibration:
         2. 9.3.1.2 System Calibration
            1. 9.3.1.2.1 System Calibration Offset Coefficient Determination Mode
            2. 9.3.1.2.2 System Calibration Gain Coefficient Determination Mode
            3. 9.3.1.2.3 Post-Calibration Scaling
      2. 9.3.2 True Continuous Background Calibration
      3. 9.3.3 Continuous Background Sensor Diagnostics
      4. 9.3.4 Flexible Input MUX Channels
      5. 9.3.5 Programmable Gain Amplifiers (FGA & PGA)
      6. 9.3.6 Excitation Current Sources (IB1 & IB2) - LMP90080/LMP90078
      7. 9.3.7 Signal Path
         1. 9.3.7.1 Reference Input (VREF)
         2. 9.3.7.2 Flexible Input MUX (VIN)
         3. 9.3.7.3 Selectable Gains (FGA and PGA)
         4. 9.3.7.4 Buffer (BUFF)
         5. 9.3.7.5 Internal/External CLK Selection
         6. 9.3.7.6 Programmable ODRS
         7. 9.3.7.7 Digital Filter
         8. 9.3.7.8 GPIO (D0-D6)
   4. 9.4 Device Functional Modes
      1. 9.4.1 Channels Scan Mode
         1. 9.4.1.1 ScanMode0: Single-Channel Continuous Conversion
         2. 9.4.1.2 ScanMode1: Multiple-Channels Single Scan
         3. 9.4.1.3 ScanMode2: Multiple-Channels Continuous Scan
         4. 9.4.1.4 ScanMode3: Multiple-Channels Continuous Scan with Burnout Currents
      2. 9.4.2 Sensor Interface
         1. 9.4.2.1 IB1 & IB2 - Excitation Currents (LMP90080/LMP90078)
         2. 9.4.2.2 Burnout Currents
            1. 9.4.2.2.1 Burnout Current Injection
         3. 9.4.2.3 Sensor Diagnostic Flags
            1. 9.4.2.3.1 SHORT_THLD_FLAG
            2. 9.4.2.3.2 RAILS_FLAG
            3. 9.4.2.3.3 POR_AFT_LST_RD
            4. 9.4.2.3.4 OFLO_FLAGS
            5. 9.4.2.3.5 SAMPLED_CH
   5. 9.5 Programming
      1. 9.5.1 Serial Digital Interface
         1. 9.5.1.1 Register Address (ADDR)
         2. 9.5.1.2 Register Read/Write Protocol
         3. 9.5.1.3 Streaming
         4. 9.5.1.4 CSB - Chip Select Bar
         5. 9.5.1.5 SPI Reset
         6. 9.5.1.6 DRDYB - Data Ready Bar
            1. 9.5.1.6.1 DrdybCase1: Combining SDO/DRDYB with SDO_DRDYB_DRIVER = 0x00
            2. 9.5.1.6.2 DrdybCase2: Combining SDO/DRDYB with SDO_DRDYB_DRIVER = 0x03
            3. 9.5.1.6.3 DrdybCase3: Routing DRDYB to D6
         7. 9.5.1.7 Data Only Read Transaction
         8. 9.5.1.8 Cyclic Redundancy Check (CRC)
      2. 9.5.2 RESET and RESTART
      3. 9.5.3 Register Read/Write Examples
         1. 9.5.3.1 Writing to Register Examples
         2. 9.5.3.2 Reading from Register Example
      4. 9.5.4 Streaming Examples
         1. 9.5.4.1 Normal Streaming Example
         2. 9.5.4.2 Controlled Streaming Example
   6. 9.6 Register Maps
      1. 9.6.1 Power and Reset Registers
      2. 9.6.2 ADC Registers
      3. 9.6.3 Channel Configuration Registers
      4. 9.6.4 Calibration Registers
      5. 9.6.5 Sensor Diagnostic Registers
      6. 9.6.6 SPI Registers
      7. 9.6.7 GPIO Registers
10. 10Application and Implementation
    1. 10.1 Application Information
       1. 10.1.1 Connecting the Supplies
          1. 10.1.1.1 VA and VIO
          2. 10.1.1.2 VREF
       2. 10.1.2 Quick Start
       3. 10.1.3 ADC_DOUT Calculation
    2. 10.2 Typical Applications
       1. 10.2.1 Typical Sensor Application
          1. 10.2.1.1 Design Requirements
          2. 10.2.1.2 Detailed Design Procedure
          3. 10.2.1.3 Application Curve
       2. 10.2.2 3-Wire RTD
          1. 10.2.2.1 Design Requirements
          2. 10.2.2.2 Detailed Design Procedure
          3. 10.2.2.3 Application Curve
       3. 10.2.3 Thermocouple and IC Analog Temperature
          1. 10.2.3.1 Design Requirements
          2. 10.2.3.2 Detailed Design Procedure
          3. 10.2.3.3 Application Curve
11. 11Power Supply Recommendations
12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
13. 13器件和文檔支持
    1. 13.1 器件支持
       1. 13.1.1 器件命名規(guī)則
    2. 13.2 相關(guān)鏈接
    3. 13.3 社區(qū)資源
    4. 13.4 商標(biāo)
    5. 13.5 靜電放電警告
    6. 13.6 Glossary
14. 14機(jī)械、封裝和可訂購(gòu)信息