ZHCSGL2E December 2016 – December 2023 LMK62A2-100M , LMK62A2-150M , LMK62A2-156M , LMK62A2-200M , LMK62A2-266M , LMK62E0-156M , LMK62E2-100M , LMK62E2-156M , LMK62I0-100M , LMK62I0-156M
PRODUCTION DATA
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | LMK62XX (2) (3) (4) | UNIT | |||
|---|---|---|---|---|---|
| SIA (QFM ) | |||||
| 6 PINS | |||||
| Airflow (LFM) 0 | |||||
| RθJA | Junction-to-ambient thermal resistance | 94.5 | °C/W | ||
| RθJC(top) | Junction-to-case (top) thermal resistance | 65.1 | °C/W | ||
| RθJB | Junction-to-board thermal resistance | 59 | °C/W | ||
| ψJT | Junction-to-top characterization parameter | 23.3 | °C/W | ||
| ψJB | Junction-to-board characterization parameter | 64.1 | °C/W | ||
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W | ||