ZHCSG14D October 2015 – October 2017 LMK61A2-100M , LMK61A2-125M , LMK61A2-156M , LMK61A2-312M , LMK61A2-644M , LMK61E0-050M , LMK61E0-155M , LMK61E0-156M , LMK61E2-100M , LMK61E2-125M , LMK61E2-156M , LMK61E2-312M , LMK61I2-100M
PRODUCTION DATA.
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
The LMK61XX is a high performance device. Therefore, pay careful attention to device configuration and printed-circuit board (PCB) layout with respect to power consumption. The ground pin needs to be connected to the ground plane of the PCB through three vias or more, as shown in Figure 18, to maximize thermal dissipation out of the package.
Equation 1 describes the relationship between the PCB temperature around the LMK61XX and its junction temperature.
where
To ensure that the maximum junction temperature of LMK61X2 is below 125°C, the maximum PCB temperature without airflow should be at 99°C or below (89°C or below for LMK61X0) when the device is optimized for best performance resulting in maximum on-chip power dissipation of 0.68 W.