ZHCSFX5C December 2016 – December 2017 LMK60E0-156M , LMK60E0-212M , LMK60E2-100M , LMK60E2-125M , LMK60E2-156M , LMK60I2-100M , LMK60I2-322M
PRODUCTION DATA.
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | LMK60EX (2)(3)(4) | UNIT | |||
|---|---|---|---|---|---|
| SIA (QFM) | |||||
| 6 PINS | |||||
| Airflow (LFM) 0 | |||||
| RθJA | Junction-to-ambient thermal resistance | 74.8 | °C/W | ||
| RθJC(top) | Junction-to-case (top) thermal resistance | 46.7 | °C/W | ||
| RθJB | Junction-to-board thermal resistance | 49.0 | °C/W | ||
| ψJT | Junction-to-top characterization parameter | 14.8 | °C/W | ||
| ψJB | Junction-to-board characterization parameter | 48.7 | °C/W | ||
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W | ||